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CY7C1046BN
1M x 4 Static RAM
Features
* Low active power -- 825 mW (max) * Low CMOS standby power * * * * * -- 44 mW (max) 2.0V data retention (400 W at 2.0V retention) Automatic power down when deselected TTL-compatible inputs and outputs Easy memory expansion with CE and OE features Available in non Pb-free 400 mil wide 32-pin SOJ package You write to the device by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. Data on the four IO pins (IO0 through IO3) is then written into the location specified on the address pins (A0 through A19). You read from the device by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing Write Enable (WE) HIGH. Under these conditions, the contents of the memory location specified by the address pins appears on the IO pins. The four input and output pins (IO0 through IO3) are placed in a high impedance state when the device is deselected (CE HIGH), the outputs are disabled (OE HIGH), or when the write operation is active (CE LOW, and WE LOW). The CY7C1046BN is available in a standard 400-mil-wide 32-pin SOJ package with center power and ground (revolutionary) pinout.
Functional Description
The CY7C1046BN is a high performance CMOS static RAM organized as 1,048,576 words by 4 bits. Easy memory expansion is provided by an active LOW Chip Enable (CE), an active LOW Output Enable (OE), and tri-state drivers.
Logic Block Diagram
Pin Configuration
SOJ TOP VIEW
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10
INPUT BUFFER
IO 0
SENSE AMPS 1M x 4 ARRAY
IO 1 IO 2 IO 3
CE WE OE
COLUMN DECODER
POWER DOWN
A0 A1 A2 A3 A4 CE IO0 VCC GND IO1 WE A5 A6 A7 A8 A9
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
A19 A18 A17 A16 A15 OE IO3 GND VCC IO2 A14 A13 A12 A11 A10 NC
ROW DECODER
Selection Guide
7C1046BN-15 Maximum Access Time (ns) Maximum Operating Current (mA) Maximum CMOS Standby Current (mA) 15 150 8
Cypress Semiconductor Corporation Document #: 001-11924 Rev. **
A 11 A 12 A 13 A14 A15 A16 A17 A18 A19
1046B-1
1046B-2
*
198 Champion Court
*
San Jose, CA 95134-1709 * 408-943-2600 Revised November 30, 2006
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CY7C1046BN
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the device. User guidelines are not tested. Storage Temperature ................................. -65C to +150C Ambient Temperature with Power Applied............................................. -55C to +125C Supply Voltage on VCC Relative to GND[1] .... -0.5V to +7.0V DC Voltage Applied to Outputs in High-Z State[1] ....................................-0.5V to VCC + 0.5V DC Input Voltage[1] .................................-0.5V to VCC + 0.5V
Current into Outputs (LOW)......................................... 20 mA Static Discharge Voltage............................................ >2001V (in accordance with MIL-STD-883, Method 3015) Latch-Up Current ..................................................... >200 mA
Operating Range
Range Commercial Ambient Temperature[2] 0C to +70C VCC 4.5V-5.5V
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions 7C1046BN-15 Min VOH VOL VIH VIL IIX IOZ ICC ISB1 ISB2 Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage[1] GND < VI < VCC GND < VOUT < VCC, Output Disabled VCC = Max, f = fMAX = 1/tRC Max VCC, CE > VIH, VIN > VIH or VIN < VIL, f = fMAX Max VCC, CE > VCC - 0.3V, VIN > VCC - 0.3V, or VIN < 0.3V, f = 0 VCC = Min, IOH = -4.0 mA VCC = Min, IOL = 8.0 mA 2.2 -0.3 -1 -1 2.4 0.4 VCC + 0.3 0.8 +1 +1 150 20 8 Max Unit V V V V mA mA mA mA mA
Input Load Current Output Leakage Current VCC Operating Supply Current Automatic CE Power Down Current - TTL Inputs Automatic CE Power Down Current - CMOS Inputs
Capacitance[3]
Parameter CIN COUT Description Input Capacitance IO Capacitance Test Conditions TA = 25C, f = 1 MHz, VCC = 5.0V Max 6 6 Unit pF pF
Notes 1. VIL (min) = -2.0V for pulse durations of less than 20 ns. 2. TA is the "Instant On" case temperature. 3. Tested initially and after any design or process changes that may affect these parameters.
Document #: 001-11924 Rev. **
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CY7C1046BN
AC Test Loads and Waveforms
R1 481 R1 481 ALL INPUT PULSES Vcc 90% GND R2 255 Rise Time:1 V/ns
1046B-3
5V OUTPUT 30 pF
5V OUTPUT R2 255 5 pF
90%VCC 10%VCC
10%
INCLUDING JIG AND SCOPE (a)
INCLUDING JIG AND SCOPE (b)
Fall Time:1 V/ns
1046B-4
Equivalent to:
THEVENIN EQUIVALENT 167 1.73V OUTPUT
Switching Characteristics (over the operating range)[4]
7C1046BN-15 Parameter READ CYCLE tpower tRC tAA tOHA tACE tDOE tLZOE tHZOE tLZCE tHZCE tPU tPD VCC(typ) to the First Access[5] Read Cycle Time Address to Data Valid Data Hold from Address Change CE LOW to Data Valid OE LOW to Data Valid OE LOW to OE HIGH to CE LOW to Low-Z[7] High-Z[6, 7] 3 7 0 15 0 7 3 15 7 1 15 15 s ns ns ns ns ns ns ns ns ns ns ns Description Min Max Unit
Low-Z[7]
CE HIGH to High-Z[6, 7] CE LOW to Power Up CE HIGH to Power Down
Notes 4. Test conditions are based on signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL/IOH and 30-pF load capacitance. 5. This part has a voltage regulator which steps down the voltage from 5V to 3.3V internally. tPOWER is the time that the power needs to be supplied above VCC (typ) initially before a Read or Write operation can be initiated. 6. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured 500 mV from steady-state voltage. 7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
Document #: 001-11924 Rev. **
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CY7C1046BN
Switching Characteristics (over the operating range)[4] (continued)
7C1046BN-15 Parameter WRITE CYCLE tWC tSCE tAW tHA tSA tPWE tSD tHD tLZWE tHZWE
[8, 9]
Description
Min
Max
Unit
Write Cycle Time CE LOW to Write End Address Setup to Write End Address Hold from Write End Address Setup to Write Start WE Pulse Width Data Setup to Write End Data Hold from Write End WE HIGH to WE LOW to Low-Z[7] High-Z[6, 7]
15 10 10 0 0 10 8 0 3 7
ns ns ns ns ns ns ns ns ns ns
Data Retention Characteristics (over the operating range)
Parameter VDR ICCDR tCDR[3] tR Description VCC for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time Com'l VCC = VDR = 2.0V, CE > VCC - 0.3V VIN > VCC - 0.3V or VIN < 0.3V 0 200 Conditions[10] Min 2.0 200 Max Unit V A ns s
Data Retention Waveform
DATA RETENTION MODE VCC CE
1046B-5
3.0V tCDR
VDR > 2V
3.0V tR
Notes 8. The internal memory write time is defined by the overlap of CE LOW, and WE LOW. CE and WE must be LOW to initiate a write, and the transition of either of these signals can terminate the write. The input data setup and hold timing must be referenced to the leading edge of the signal that terminates the write. 9. The minimum write cycle time for write cycle 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD. 10. No input may exceed VCC + 0.5V.
Document #: 001-11924 Rev. **
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CY7C1046BN
Switching Waveforms
Read Cycle 1[11, 12]
tRC ADDRESS tAA tOHA DATA OUT
PREVIOUS DATA VALID
DATA VALID
1046B-6
Read Cycle 2 (OE controlled)[12, 13]
ADDRESS tRC CE
tACE OE tDOE DATA OUT tLZOE HIGH IMPEDANCE tLZCE tHZOE tHZCE DATA VALID tPD 50% 50% ISB
1046B-7
HIGH IMPEDANCE
V CC
SUPPLY
tPU
ICC
CURRENT
Notes 11. Device is continuously selected. OE, CE = VIL. 12. WE is HIGH for read cycle. 13. Address valid before or similar to CE transition LOW.
Document #: 001-11924 Rev. **
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CY7C1046BN
Switching Waveforms (continued)
Write Cycle 1 (CE controlled)[14, 15]
tWC ADDRESS tSCE CE tSA tSCE tAW tPWE WE tSD DATA IO
DATA VALID
tHA
tHD
1046B-8
Write Cycle 2 (WE controlled, OE HIGH during write)[14, 15]
tWC ADDRESS tSCE CE tAW tSA WE tPWE tHA
OE tSD DATA IO NOTE 16 tHZOE DATAIN VALID
1046B-9
tHD
Notes 14. Data IO is high impedance if OE = VIH. 15. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high impedance state. 16. During this period the IOs are in the output state and input signals must not be applied.
Document #: 001-11924 Rev. **
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CY7C1046BN
Switching Waveforms (continued)
Write Cycle 3 (WE controlled, OE LOW)[15]
tWC ADDRESS tSCE CE
tAW tSA WE tSD DATA IO NOTE 16 tHZWE tPWE
tHA
tHD
DATA VALID
tLZWE
1046B-10
Ordering Information
Speed (ns) 15 Ordering Code CY7C1046BN-15VC Package Diagram 51-85033 Package Type 32-Pin (400-Mil) Molded SOJ Operating Range Commercial
Document #: 001-11924 Rev. **
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CY7C1046BN
Package Diagram
Figure 1. 32-pin (400-Mil) Molded SOJ, 51-85033
51-85033-*B
All products and company names mentioned in this document may be the trademarks of their respective holders.
Document #: 001-11924 Rev. **
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(c) Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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CY7C1046BN
Document History Page
Document Title: CY7C1046BN 1M x 4 Static RAM Document Number: 001-11924 REV. ** ECN NO. 610496 Issue Date Orig. of Change See ECN NXR Description of Change New data sheet
Document #: 001-11924 Rev. **
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